examples include hot-swappable 18-layer 4-mil PCB with 622-MHz
clocks, LVDS, LVPECL, fiber-optic transponders, -48V supplies,
DC/DC, PowerPC CPU, Xilinx, Altera & Triscend FPGAs, SONET Framers,
TL1 command language support, OC-3/OC-12 Network Processor-based
PCI-bus ATM/POS Network Interface Cards, 480 MHz Ultra-Sparc Hot-Swap
Compact-PCI PCB, etc.
Managed auxiliary services include layout, component procurement, fab,
assembly and testing. Comit
engineers can work with you to determine high speed signal management
strategies and material selection issues for high-speed multilayer
with Comit's chip design and embedded software development capabilities,
you have the ability to finally implement a one-stop contracting strategy
that minimizes third party interactions and enables faster
turnarounds for your products.